The artificial intelligence (AI) infrastructure build-out is hitting a physical wall. As next-generation processors push past the 1,000-watt threshold, legacy packaging substrates are failing to dissipate the extreme heat generated by these clusters.
COHR's record FY26 results and strong FY27 outlook face a tougher test as surging capex, rising inventory and capacity constraints raise execution risks.
Coherent announced that it has begun sampling of its 300mm high thermal conductivity silicon carbide (SiC) substrates to leading AI semiconductor partners.